GB/T 26067-2010 (English Version) PDF

Standard No.: GB/T 26067-2010
Language: Chinese, Available in English version
Release Date: 2011
Published By: General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest: GB/T 26067-2010

Scope: 1. This standard qualitatively provides a non-destructive test method to determine whether the reference notch of a silicon wafer meets the standard limit requirements. The test principle of this method is also applicable to the measurement of other notch sizes. 2. When the plane size of the object in this standard is 0.1mm, a 2.0mm image will be formed on the projection screen after magnification of 20 times, and a projection of 5.0mm will be produced after magnification of 50 times. This method can find the smallest size details on the incision contour. 3. This standard does not provide a test for the radius of curvature at the top of the cutout.

GB/T 26067-2010 Referenced Document

GB/T 14264 Semiconductor materials-Terms and definitions
GB/T 2828.1 Inspection procedure by count sampling part 1: Lot by lot inspection sampling plan retrieved by acceptance quality limit (AQL)*， 2013-02-15 Update

2011 GB/T 26067-2010 Standard test method for dimensions of notches on silicon wafers