GB/T 26066-2010
Practice for shallow etch pit detection on silicon (English Version)

Standard No.

GB/T 26066-2010

Language

Chinese, Available in English version

Release Date

2011

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Latest

GB/T 26066-2010

Scope

This standard specifies the inspection method for shallow corrosion pits caused by contamination on polished wafers or epitaxial surfaces by thermal oxidation and chemical preferential etching techniques. This standard is suitable for testing p-type or n-type polished wafers or epitaxial wafers with <111> or <100> crystal orientation, and the resistivity is greater than 0.001Ω·cm.

GB/T 26066-2010 Referenced Document

• GB/T 14264 Semiconductor materials-Terms and definitions

GB/T 26066-2010 history

• 2011 GB/T 26066-2010 Practice for shallow etch pit detection on silicon