DIN EN 62137:2005
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN (IEC 62137:2004 + Corrigendum:2005); German version EN 62137:2004
- Standard No.
- DIN EN 62137:2005
- Release Date
- 2005
- Published By
- German Institute for Standardization
- Status
- Replace By
- DIN EN 62137-4:2015
- Latest
- DIN EN 62137-4:2015
- Replace
- DIN IEC 62137:2001
- Scope
- This Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages an peripheral terminal type packages.
DIN EN 62137:2005 history
- 2015 DIN EN 62137-4:2015 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015
- 2005 DIN EN 62137:2005 Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN (IEC 62137:2004 + Corrigendum:2005); German version EN 62137:2004
- 0000 DIN IEC 62137:2001
