YS/T 747-2010
Lead-free tin-based solder (English Version)

Standard No.

YS/T 747-2010

Language

Chinese, Available in English version

Release Date

2010

Published By

Professional Standard - Non-ferrous Metal

Latest

YS/T 747-2010

Scope

This standard specifies the product requirements, test methods, inspection rules, packaging, labeling, storage and transportation, contract (or order order) requirements, etc. for lead-free tin-based solder. This standard is applicable to alloy solders with metal tin as the main component, no flux added, zinc, copper, antimony, silver, bismuth, nickel, indium, etc. added according to different components, and cast or machined.

YS/T 747-2010 Referenced Document

• GB/T 728 Tin ingot*， 2020-03-06 Update
• GB/T 8170 Rules of rounding off for numerical values & expression and judgement of limiting values

YS/T 747-2010 history

• 2010 YS/T 747-2010 Lead-free tin-based solder