ASTM F677-04(2009)
Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications

Standard No.
ASTM F677-04(2009)
Release Date
2004
Published By
American Society for Testing and Materials (ASTM)
Status
Replace By
ASTM F677-13
Latest
ASTM F677-13
Scope

Fluids and greases in contact with encapsulating compounds may adversely modify the encapsulant properties with resulting damage or loss of protection to components in electronic applications.

This test method provides a means for measuring the effect of fluids and greases on various encapsulants.

This test method is intended for use in research and evaluation.

1.1 This test method determines the resistance of encapsulating compounds to fluids or greases by measuring changes in weight (Note 1) and volume under defined conditions of time and temperature.

Note 18212;To provide consistency with the usage in other ASTM test methods concerned with determining the properties of plastic materials, the terms weight and weigh are used in this test method although the units of measurement are those of mass.

1.2 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. See 9.1.

1.3 The values stated in SI units are standard. The values in parentheses are for information only.

Note 28212;There is no similar or equivalent IEC standard.

ASTM F677-04(2009) history

  • 2013 ASTM F677-13 Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
  • 2004 ASTM F677-04(2009) Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
  • 2004 ASTM F677-04 Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
  • 1995 ASTM F677-95(1999) Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications



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