DIN EN 62137-1-5:2010
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5: Mechanical shear fatigue test (IEC 62137-1-5:2009); German version EN 62137-1-5:2009
- Standard No.
- DIN EN 62137-1-5:2010
- Release Date
- 2010
- Published By
- German Institute for Standardization
- Latest
- DIN EN 62137-1-5:2010
- Replace
- DIN IEC 62137-1-5:2007
- Scope
- The test method described in this part of IEC 62137 applies to area array packages, such as BGA.
DIN EN 62137-1-5:2010 Referenced Document
- IEC 60068-1 Environmental testing - Part 1: General and guidance*， 2013-10-01 Update
- IEC 60194 Printed board design, manufacture and assembly - Terms and definitions*， 2015-04-01 Update
- IEC 61188-5 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
- IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications*， 2017-12-13 Update
- IEC 61760-1 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)*， 2020-07-14 Update
DIN EN 62137-1-5:2010 history
- 2010 DIN EN 62137-1-5:2010 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5: Mechanical shear fatigue test (IEC 62137-1-5:2009); German version EN 62137-1-5:2009
- 0000 DIN IEC 62137-1-5:2007
