SJ/T 11392-2009
Lead-free solders-Chemical compositions and forms (English Version)
- Standard No.
- SJ/T 11392-2009
- Language
- Chinese, Available in English version
- Release Date
- 2009
- Published By
- Professional Standard - Electron
- Status
- 2020-07
- Replace By
- SJ/T 11392-2019
- Latest
- SJ/T 11392-2019
- Scope
- This standard specifies the technical requirements, test methods, inspection rules, packaging, marking, transportation and storage of lead-free solder. This standard applies to lead-free solder.
SJ/T 11392-2009 Referenced Document
- GB/T 10574.1-2003 Methods for chemical analysis of tin-lead solders--Determination of tin content
- GB/T 10574.2-2003 Methods for chemical analysis of Tin-lead solders--Determination of antimony content
- GB/T 3260.1-2000 Methods for chemical analysis of tin Determination of copper content
- GB/T 3260.10-2000 Methods for chemical analysis of tin Determination of sulphur content
- GB/T 3260.11-2000 Methods for chemical analysis of tin Determination of cadmium content
- GB/T 3260.2-2000 Methods for chemical analysis of tin Determination of iron content
- GB/T 3260.3-2000 Methods for chemical analysis of tin Determination of iron content
- GB/T 3260.4-2000 Methods for chemical analysis of tin Determination of lead content
- GB/T 3260.5-2000 Methods for chemical analysis of tin Determination of antimony content
- GB/T 3260.6-2000 Methods for chemical analysis of tin Determination of arsenic content
- GB/T 3260.7-2000 Methods for chemical analysis of tin Determination of aluminum content
- GB/T 3260.9-2000 Methods for chemical analysis of tin Determination of lead,copper and zinc content
SJ/T 11392-2009 history
- 2019 SJ/T 11392-2019 Chemical composition and morphology of lead-free solder
- 2009 SJ/T 11392-2009 Lead-free solders-Chemical compositions and forms
