JIS C 60068-2-20:1996 Basic environmental testing procedures Part 2: Tests. Test T: Soldering
JIS C 60068-2-58:2006 Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
JIS C 60068-2-78:2004 Environmental testing -- Part 2-78: Tests -- Test Cab: Damp heat, steady state
JIS C 60068-2-82:2009 history
2021JIS C 60068-2-82:2021 Environmental testing -- Part 2-82: Tests -- Test Xw1: Whisker test methods for components and parts used in electronic assemblies
2009JIS C 60068-2-82:2009 Environmental testing -- Part 2-82: Tests -- Test XW1: Whisker test methods for electronic and electric components