BS EN 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5:Mechanical shear fatigue test
The test method described in this part of IEC 62137 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce the
strains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion) mismatch, as shown in Figure 2. In place of the temperature cycle test, the mechanical shear fatigue predicts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the evaluation requires first to mount the surface mount component on the
substrate by reflow soldering, then cyclic mechanical shear deformation is applied to the
solder joints until fracture of the solder joints occurs. The properties of the solder joints (for
example solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.
BS EN 62137-1-5:2009 Referenced Document
IEC 60068-1 Environmental testing - Part 1: General and guidance*, 2013-10-01 Update
IEC 60194 Printed board design, manufacture and assembly - Terms and definitions*, 2015-04-01 Update
IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications*, 2017-12-13 Update
IEC 61760-1 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)*, 2020-07-14 Update
BS EN 62137-1-5:2009 history
2009BS EN 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5:Mechanical shear fatigue test