IEC 60749-20-1:2009
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Standard No.

IEC 60749-20-1:2009

Release Date

2009

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced

Replace By

IEC 60749-20-1:2019 RLV

Latest

IEC 60749-20-1:2019 RLV

Replace

IEC 47/2010/FDIS:2009 IEC/PAS 62168:2000 IEC/PAS 62169:2000

IEC 60749-20-1:2009 history

• 0000 IEC 60749-20-1:2019 RLV
• 2009 IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat