IEC 60749-23:2004
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

Standard No.

IEC 60749-23:2004

Release Date

2004

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced

Replace By

IEC 60749-23:2011

Latest

IEC 60749-23:2004/AMD1:2011

Replace

IEC 47/1735/FDIS:2003

Scope

This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.

IEC 60749-23:2004 history

• 2011 IEC 60749-23:2004/AMD1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
• 2011 IEC 60749-23:2011 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
• 2004 IEC 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life