DIN EN 60749-37:2008
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008); German version EN 60749-37:2008
- Standard No.
- DIN EN 60749-37:2008
- Release Date
- 2008
- Published By
- German Institute for Standardization
- Status
- Replace By
- DIN EN 60749-37:2008-08
- Latest
- DIN EN 60749-37:2008-08
DIN EN 60749-37:2008 Referenced Document
- IEC 60749-20-1 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering*， 2019-06-26 Update
DIN EN 60749-37:2008 history
- 2008 DIN EN 60749-37:2008-08 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008); German version EN 60749-37:2008 / Note: To be replaced by DIN EN IEC 60749-37 (2023-02).
- 2008 DIN EN 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008); German version EN 60749-37:2008
