ASTM F542-98
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

Standard No.

ASTM F542-98

Release Date

1998

Published By

American Society for Testing and Materials (ASTM)

Status

Be replaced

Replace By

ASTM F542-02

Latest

ASTM F542-07

Scope

1.1 This test method covers a means for measuring the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.

1.2 This test method measures the potential heat output of an encapsulating compound under conditions that provide no significant heat sink.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 6.

ASTM F542-98 history

• 2007 ASTM F542-07 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
• 2002 ASTM F542-02 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
• 1998 ASTM F542-98 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation