ASTM F1709-97(2002)
Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications

Standard No.

ASTM F1709-97(2002)

Release Date

1997

Published By

American Society for Testing and Materials (ASTM)

Status

Be replaced

Replace By

ASTM F1709-97(2008)

Latest

ASTM F1709-97(2016)

Scope

1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.

1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging.

1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.

ASTM F1709-97(2002) history

• 2016 ASTM F1709-97(2016) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
• 1997 ASTM F1709-97(2008) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
• 1997 ASTM F1709-97(2002) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
• 1996 ASTM F1709-97 Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications