ASTM D1867-01
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring

Standard No.

ASTM D1867-01

Release Date

2001

Published By

American Society for Testing and Materials (ASTM)

Status

Be replaced

Replace By

ASTM D1867-07

Latest

ASTM D1867-13

Scope

1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

ASTM D1867-01 history

• 2013 ASTM D1867-13 Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
• 2007 ASTM D1867-07 Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
• 2001 ASTM D1867-01 Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
• 1996 ASTM D1867-96 Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring