ASTM B885-97
Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts

Standard No.
ASTM B885-97
Release Date
1997
Published By
American Society for Testing and Materials (ASTM)
Status
Replace By
ASTM B885-97(2003)
Latest
ASTM B885-09(2020)
Scope

1.1 This test method defines a resistance probing test for detecting the presence of foreign matter on Printed Wiring Board (PWB) contacts or fingers that adversely affects electrical performance. This test method is defined specifically for such fingers coated with gold. Application of this test method to other types of electrical contacts or to fingers coated with other materials may be possible and desirable but may require some changes in fixturing, procedures, or failure criteria.

1.2 Practice B 667 describes another contact resistance probe method that has more general application to electrical contacts of various materials and shapes. Practice B 667 should be used for more fundamental studies. This test method provides a fast inspection method for printed wiring board fingers.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

ASTM B885-97 history

  • 2020 ASTM B885-09(2020) Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
  • 2009 ASTM B885-09(2015) Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
  • 2009 ASTM B885-09 Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
  • 1997 ASTM B885-97(2003) Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
  • 1997 ASTM B885-97 Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts



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