ASTM B490-92(1998)
Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits

Standard No.

ASTM B490-92(1998)

Release Date

1992

Published By

American Society for Testing and Materials (ASTM)

Status

Be replaced

Replace By

ASTM B490-92(2003)

Latest

ASTM B490-09(2021)

Scope

1.1 This practice describes a procedure for measuring the ductility of electrodeposited foils.

1.2 This practice is suitable only for the evaluation of electrodeposits having low ductility.

1.3 The obtained ductility values must only be considered semi-quantitative because this test has a significant operator dependence.

1.4 This practice is best used for in-house process control where measurements are always made by the same operator. A change in ductility value can be used as an indication of possible changes in the electroplating solution.

1.5 This standard does not purport to address the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

ASTM B490-92(1998) history

• 2021 ASTM B490-09(2021) Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
• 2009 ASTM B490-09(2014) Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
• 2009 ASTM B490-09 Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
• 1992 ASTM B490-92(2008)e1 Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
• 1992 ASTM B490-92(2003) Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
• 1992 ASTM B490-92(1998) Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits