ASTM F1727-97
Standard Practice for Detection of Oxidation Induced Defects in Polished Silicon Wafers

Standard No.
ASTM F1727-97
Release Date
1997
Published By
American Society for Testing and Materials (ASTM)
Status
Replace By
ASTM F1727-02
Latest
ASTM F1727-02
Scope

1.1 This practice covers the detection of crystalline defects in the surface region of silicon wafers. The defects are induced or enhanced by oxidation cycles encountered in normal device processing. An atmospheric pressure, oxidation cycle representative of bipolar, metal-oxide-silicon (MOS) and CMOS technologies is included. This practice is required to reveal strain fields arising from the presence of precipitates, oxidation induced stacking faults, and shallow etch pits. Slip is also revealed that arises when internal or edge stresses are applied to the wafer.

1.2 Application of this practice is limited to specimens that have been chemical or chemical/mechanical polished to remove surface damage from at lease one side of the specimen. This practice may also be applied to detection of defects in epitaxial layers.

1.3 The surface of the specimen opposite the surface to be investigated may be damaged deliberately or otherwise treated for gettering purposes or chemically etched to remove damage.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

ASTM F1727-97 Referenced Document

  • ASTM D5127 Standard Guide for Ultra Pure Water Used in the Electronics and Semiconductor Industry*1999-04-19 Update
  • ASTM F1241 
  • ASTM F1725 Standard Guide for Analysis of Crystallographic Perfection of Silicon Ingots
  • ASTM F1726 Standard Guide for Analyis of Crystallographic Perfection of Silicon Wafers
  • ASTM F1809 Standard Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon
  • ASTM F1810 

ASTM F1727-97 history

Standard Practice for Detection of Oxidation Induced Defects in Polished Silicon Wafers



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