This International Standard specifies the requirements for chemical composition for the following families of soft solder alloys:
— tin-lead, with and without antimony;
— tin-silver, with and without lead;
— tin-copper, with and without lead;
— tin-antimony;
— tin-lead-bismuth;
— bismuth-tin;
— tin-lead-cadmium;
— tin-indium;
— lead-silver, with and without tin.
An indication of the forms generally available is also included.
SS ISO 9453:1990 history
1990SS ISO 9453:1990 SPECIFICATION FOR Soft Solder Alloys - Chemical Compositions And Forms