1.1 This Malaysian Standard prescribes methods for the determination of tin. lead, antimony, copper, bismuth, zinc, iron, aluminium, arsenic and silver found in various grades of soft solder covered by MS 870*.
1.2 The analytical procedures appear in the following order:
Clause
Tin by the nickel coil reduction method 4
Lead by the photometric dithizone method 5
Antimony by the volumetric potassium bromate method 6
Copper by the photometric cupric bromide method 7
Bismuth by the photometric thiourea method 8
Zinc by the photometric dithizone method 9
Iron by the photometric ortho-phenanthroline method 10
Aluminium by the photometric method 11
Arsenic by the photometric molybdenum blue method 12
Silver by the titrimetric ammonium thipcyanate method 13
Spectrographic analysis by the powder technique 14
MS 1004-1986 history
1986MS 1004-1986 Chemical analysis methods of soft solder