This standard specifies the necessary relevant terminology, product classification, technical requirements, test methods, detection rules, marking, packaging, transportation, storage, etc. of silicon single crystal polished wafers (abbreviated as silicon polished wafers). This standard applies to silicon polishing wafers prepared by single-sided polishing after Czochralski silicon single crystal abrasive wafers are etched and thinned. The products are mainly used to make semiconductor devices such as integrated circuits or as substrates for silicon epitaxial deposition.