GB/T 19248-2003
Test method for measuring the resistance of package leads (English Version)

Standard No.

GB/T 19248-2003

Language

Chinese, Available in English version

Release Date

2003

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Latest

GB/T 19248-2003

Scope

This standard specifies the method for measuring package lead resistance. This standard applies to the test of pin grid array package (PGA) lead resistance. This test technique is also applicable to the test of lead resistance of other microelectronic packages such as leadless chip carrier (LCC), quad flat package (QFP) and ceramic dual inline package (CDIP).

GB/T 19248-2003 history

• 2003 GB/T 19248-2003 Test method for measuring the resistance of package leads