JIS Z 3198-5:2003
Test methods for lead-free solders -- Part 5: Methods for tensile tests and shear tests on solder joints

Standard No.

JIS Z 3198-5:2003

Release Date

2003

Published By

Japanese Industrial Standards Committee (JISC)

Latest

JIS Z 3198-5:2003

Scope

This standard specifies tensile and shear testing methods for lead-free solder joints used primarily for wiring connections and parts connections for electrical equipment, electronic equipment, communication equipment, etc.

JIS Z 3198-5:2003 history

• 2003 JIS Z 3198-5:2003 Test methods for lead-free solders -- Part 5: Methods for tensile tests and shear tests on solder joints