These methods describe the electrical, mechanical and thermal tests of polymerizable compounds used to embed electrical, electronic components or assemblies. The procedures appear in the following sections: Procedure Sampling Section 3 Preparation of the specimen and conditioning 4 Hardness 5 to 11 Coefficient of linear thermal expansion 12 to 18 Specific gravity 19 to 26 Coefficient of thermal conductivity 27 to 33 Resistance to thermal shock 34 to 39 Dielectric constant and dissipation factor 40 to 48 Dielectric strength 49 to 55 Arc resistance 56 to 60 Effect of high humidity 61 to 66 Flame resistance (ignition and burning time! 67 Dielectric strength of embedded electrodes 68 to 75 1.2 The Compounds may be combined without pressure and may or may not require heat to complete the reaction. They are necessary to electrically insulate, mechanically protect, and support the part or assembly without a box, tank, or other external reinforcement after curing.
ICONTEC 2203-1986 history
1986ICONTEC 2203-1986 Electronics. Embedded polymers for circuit insulators, test methods