IEC 60749-16:2003
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

Standard No.

IEC 60749-16:2003

Release Date

2003

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60749-16:2003

Replace

IEC 47/1662/FDIS:2002 IEC/PAS 62171:2000

Scope

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

IEC 60749-16:2003 history

• 2003 IEC 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)