IPC 9504-1998 PDF

Standard No.: IPC 9504-1998
Release Date: 1998
Published By: Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Latest: IPC 9504-1998

Scope: This document describes manufacturing process simulations for use with applicable component specifications to assure that electronic components can meet expected reliability requirements after exposure to assembly factory processes. It is not intended as an assembly production specification or a stand-alone qualification document. The procedure consists of a set of assembly process simulations that can be performed by either the component user or manufacturer prior to reliability testing as specified in the applicable component qualification and reliability monitoring documents. The simulations include alternative conditions depending on the component type, physical characteristics and anticipated use. The levels defined can be used for describing either expected performance characteristics by the manufacturer or the required characteristics for the users assembly process.

IPC 9504-1998 history

1998 IPC 9504-1998 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)