IPC 6016-1999
Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards

Standard No.

IPC 6016-1999

Release Date

1999

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Latest

IPC 6016-1999

Scope

This specification establishes the specific requirements for organic high-density interconnect (HDI) layers with microvia technology and the quality and reliability assurance requirements that must be met for their acquisition.

IPC 6016-1999 history

• 1999 IPC 6016-1999 Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards