Institute of Interconnecting and Packaging Electronic Circuits (IPC)
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IPC 3408-1996
Scope
This document covers requirements and test methods for
anisotropically conductive adhesive films used to bond and
electrically connect components and for their long-term
properties as a part of the printed wiring board assembly.
Applications include the foliowing: flexible PWB-to-glass,
flexible PWB-to-rigid PW, flip chip-to-glass, flip chip-toflexible
PWB, flip chip-to-rigid PWB, and fine pitch SMD.
The adhesive film may be supplied pre-attached to a flexible
circuit or other product.
IPC 3408-1996 history
1996IPC 3408-1996 General Requirements for Anisotropically Conductive Adhesive Films