IPC 3406-1996 PDF

Standard No.: IPC 3406-1996
Release Date: 1996
Published By: Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Latest: IPC 3406-1996

Scope: This document covers guidelines for selecting electrically conductive adhesives for use in assembly of components to printed circuit boards (PCB) or similar wiring interconnect systems. The focus is on the use of adhesives as solder alternatives. The process discussion attempts to stay within the bounds of the existing solder assembly infrastructure as much as possible. Both major types of adhesives, isotropic (conducting equally in all directions) and anisotropic (unidirectional conductivity), are covered. The two major divisions of polymer adhesives, thermosets and thermoplastics, are described.

IPC 3406-1996 history

1996 IPC 3406-1996 Guidelines for Electrically Conductive Surface Mount Adhesives