IPC 2615-2000 PDF

Standard No.: IPC 2615-2000
Release Date: 2000
Published By: Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Latest: IPC 2615-2000

Scope: This Standard covers dimensioning and tolerancing of electronic packaging as it relates to printed boards and the assembly of printed boards. The concepts defined in this Standard are derived from ASME Y14.5” 1994. Printed boards have such wide applications that there may be times where this standard does not address a specific case. In those cases, the user is referred to ASME Y14.5M 1994 for use of additional dimensioning and tolerancing concepts.

IPC 2615-2000 history