IPC 2226-2003
Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

Standard No.

IPC 2226-2003

Release Date

2003

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Latest

IPC 2226-2003

Scope

This standard establishes requirements and other considerations

IPC 2226-2003 history

• 2003 IPC 2226-2003 Sectional Design Standard for High Density Interconnect (HDI) Printed Boards