- Standard No.
- IEC TS 62454:2007
- Release Date
- 2007
- Published By
- International Electrotechnical Commission (IEC)
- Latest
-
IEC TS 62454:2007
- Replace
-
IEC 48D/357/DTS:2007
- Scope
- This technical specification provides interface dimensions and cooling performance guidelines
for cabinets, using water supplied heat exchangers. For a clear definition of interface
dimensions and cooling performance guidelines, only cabinets have been regarded from the
IEC 60297 (19 in) and IEC 60917 (25 mm) series.
As the cooling performance is in direct relation to volume flows and temperatures of air and
water, cooling performance guidelines are provided for two structural interface levels –
Interface level 1 and 2 – of equipment built into cabinets.
The third interface level is only described by main interfaces, but without detailed dimensions
and without cooling performance guidelines. This interface needs very complex details for the
ducting of water supply within the cabinet and down to the component heat sinks on boards
within subracks. Therefore, only the principle is shown usable for individual design solutions.
IEC TS 62454:2007 history
- 2007 IEC TS 62454:2007 Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series
IEC TS 62454:2007 Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series has been changed from IEC 48D/357/DTS:2007 IEC 62454 TS, Ed. 1: Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series.