This specification covers an electrically-conductive adhesive supplied as two components, a paste of silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid. This adhesive has been used typically for providing an electrically-conductive bond between surfaces and as an electrically-conductive sealing compound, but usage is not limited to such applications.
SAE AMS3681C-1995 Referenced Document
ASTM G21-90 Standard Practice for Determining Resistance of Synthetic Polymetric Materials to Fungi