This method uses a metal plate single-lap bonded sample to measure the tensile shear strength of the adhesive at normal temperature, high temperature and low temperature (-55℃~+450℃). This method can also evaluate the influence of surface preparation, primer, adhesive and other factors as well as the bonding process in the metal adhesive system.
HB 5164-1981 history
1981HB 5164-1981 Test method for tensile shear strength of metal bonded joints