IEC PAS 62483:2006
Test method for measuring whisker growth on tin and tin alloy surface finishes

Standard No.

IEC PAS 62483:2006

Release Date

2006

Published By

International Electrotechnical Commission (IEC)

Status

Withdraw

Latest

IEC PAS 62483:2006

Replace By

IEC 62483:2013

Scope

The methodology presented in this document, see Annex A for process flow, is applicable for studying tin whisker growth from finishes containing a predominance of tin (Sn). This test method may not be sufficient for applications with special requirements, e.g., military or aerospace. Additional requirements may be specified in the appropriate requirements document. The purpose of this PAS is to: ? Provide an industry-standardized suite of tests for measurement and comparison of whisker propensity for different plating or finish chemistries and processes. ? Provide a consistent inspection protocol for tin whisker examination. ? Provide a standard reporting format.

IEC PAS 62483:2006 history

• 2006 IEC PAS 62483:2006 Test method for measuring whisker growth on tin and tin alloy surface finishes

IEC PAS 62483:2006 Test method for measuring whisker growth on tin and tin alloy surface finishes was changed to IEC 62483:2013 Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices.