IEC 62047-3:2006
Semiconductor devices - Micro electromechanical devices - Part 3: Thin film standard test piece for tensile-testing

Standard No.
IEC 62047-3:2006
Release Date
2006
Published By
International Electrotechnical Commission (IEC)
Latest
IEC 62047-3:2006
Replace
IEC 47/1866/FDIS:2006
Scope
This International Standard specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10 µm, which are main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices. This International Standard is based on such a concept that a tensile testing system can be guaranteed in propriety and accuracy, when the measured tensile strengths of the standard test pieces, whose tensile strength is pre-determined, are within the designated range. It also specifies the test pieces to minimize characteristics deviation among the pieces.

IEC 62047-3:2006 history

  • 2006 IEC 62047-3:2006 Semiconductor devices - Micro electromechanical devices - Part 3: Thin film standard test piece for tensile-testing
Semiconductor devices - Micro electromechanical devices - Part 3: Thin film standard test piece for tensile-testing



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