IEC 60749-35:2006
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

Standard No.

IEC 60749-35:2006

Release Date

2006

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60749-35:2006

Replace

IEC 47/1863/FDIS:2006 IEC/PAS 62191:2000

Scope

This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

IEC 60749-35:2006 history

• 2006 IEC 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components