IEC 60749-39:2006
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- Standard No.
- IEC 60749-39:2006
- Release Date
- 2006
- Published By
- International Electrotechnical Commission (IEC)
- Status
- Replace By
- IEC 60749-39:2021 RLV
- Latest
- IEC 60749-39:2021 RLV
- Replace
- IEC 47/1860/FDIS:2006 IEC/PAS 62307:2002
- Scope
- This part of IEC 60749 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow. NOTE It is recommended that the moisture absorption parameters used in this standard be obtained from the material suppliers (such as the resin supplier).
IEC 60749-39:2006 history
- 0000 IEC 60749-39:2021 RLV
- 2006 IEC 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
