DIN EN 60191-3 Bb.1:2006
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
- Standard No.
- DIN EN 60191-3 Bb.1:2006
- Release Date
- 2006
- Published By
- German Institute for Standardization
- Status
- Replace By
- DIN EN 60191-3 Beiblatt 1:2006-08
- Latest
- DIN EN 60191-3 Beiblatt 1:2006-08
- Replace
- DIN EN 60191-3 Bb.1:2003
DIN EN 60191-3 Bb.1:2006 history
- 2006 DIN EN 60191-3 Beiblatt 1:2006-08 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
- 2006 DIN EN 60191-3 Bb.1:2006 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
- 2000 DIN EN 60191-3:2000-07 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
- 2000 DIN EN 60191-3:2000 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
