YS/T 606-2006
Curable silver conductive paste (English Version)
- Standard No.
- YS/T 606-2006
- Language
- Chinese, Available in English version
- Release Date
- 2006
- Published By
- Professional Standard - Non-ferrous Metal
- Status
- 2024-07
- Replace By
- YS/T 606-2023
- Latest
- YS/T 606-2023
- Scope
- This standard specifies the requirements, test methods, inspection rules and markings, packaging, storage and order form (or contract) content of cured silver conductor paste. This standard applies to low-temperature curing silver conductor pastes (hereinafter referred to as silver paste) such as silver paste for membrane switches, silver paste for carbon film potentiometer terminals, and silver conductive adhesive.
YS/T 606-2006 Referenced Document
- GB/T 17473.2 Test method of precious metals pastes used for microelectronics.Determination of fineness*， 2008-03-31 Update
- GB/T 17473.3 Test method of precious metals pastes used for microelectronics.Determination of sheet resistance*， 2008-03-31 Update
- GB/T 17473.5 Test method of precious metals pastes used for microelectronics.Determination of viscosity*， 2008-03-31 Update
- GB/T 2793 Test method for nonvolatile content of adhesives
- GB/T 6739 Paints and varnishes—Determination of film hardness by pencil test*， 2022-12-30 Update
YS/T 606-2006 history
- 2023 YS/T 606-2023 Cured conductive sliver paste
- 2006 YS/T 606-2006 Curable silver conductive paste
