GB/T 19922-2005
Standard test methods for measuring site flatness on silicon wafers by noncontact scanning (English Version)

Standard No.

GB/T 19922-2005

Language

Chinese, Available in English version

Release Date

2005

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Latest

GB/T 19922-2005

Scope

This standard specifies the method for measuring the local flatness of silicon wafer surface by capacitive displacement sensing method. This standard applies to the non-contact and non-destructive measurement of the local flatness of the dry and clean semiconductor silicon wafer surface. It is suitable for etching, polishing and epitaxial silicon wafers with a diameter of 100 mm and above and a thickness of 250 μm and above.

GB/T 19922-2005 Referenced Document

• ASTM F1530-94 Standard Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning
• GB/T 14264 Semiconductor materials-Terms and definitions *， 2009-10-30 Update

GB/T 19922-2005 history

• 2005 GB/T 19922-2005 Standard test methods for measuring site flatness on silicon wafers by noncontact scanning