GB/T 19921-2005
Test method of particles on silicon wafer surfaces (English Version)
- Standard No.
- GB/T 19921-2005
- Language
- Chinese, Available in English version
- Release Date
- 2005
- Published By
- General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
- Status
- 2019-07
- Replace By
- GB/T 19921-2018
- Latest
- GB/T 19921-2018
- Scope
- This standard specifies procedures for testing, enumerating, and reporting particles on the surface of polished silicon wafers using the Scanning Surface Inspection System (SSIS). This standard applies to silicon polished wafers, and can also be applied to silicon epitaxial wafers or other mirror polished wafers (such as compound polished wafers). This standard is also applicable to the observation of scratches, orange peel, pits, ripples and other defects on the surface of silicon polished wafers, but the detection and classification of these defects depend on the function of the equipment and are related to the initial settings during detection. Note: The methods involved in this standard usually use a laser light source with a wavelength of (48~633)nm, the most commonly used is an argon ion laser of 488nm; the minimum particle diameter that can be measured at present is 0.06μm or smaller.
GB/T 19921-2005 Referenced Document
- ASTM F1620-96 Standard Practice for Calibrating a Scanning Surface Inspection System Using Monodisperse Polystyrene Latex Spheres Deposited on Polished or Epitaxial Wafer Surfaces
- ASTM F1621-96 Standard Practice for Determining the Positional Accuracy Capabilities of a Scanning Surface Inspection System
GB/T 19921-2005 history
- 2018 GB/T 19921-2018 Test method for particles on polished silicon wafer surfaces
- 2005 GB/T 19921-2005 Test method of particles on silicon wafer surfaces
