This specification covers an adhesive compounded from modified epoxy resins in ready-to-use film supplied in rolls or sheets, either supported by mat or by woven monofilaments or unsupported. Primarily for bonding metal-to-metal or aluminum honeycomb sandwich assemblies for service up to 95 degrees C (200 degrees F). Adhesive thickness 0.005 in. (0.13 mm) is not intended for honeycomb- to-metal bonds and adhesive thickness 0.015 in. (0.38 mm) is not intended for metal-to-metal bonds.
SAE AMS3695/1-1983 history
2022SAE AMS3695/1-2022 Adhesive Film, Epoxy-Base, High Durability For 95 °C (200 °F) Service
1983SAE AMS3695/1-1983 Adhesive Film, Epoxy-Base, High Durability for 95 Degrees C (200 Degrees F) Service