This specification covers a high-temperature, electrical-grade, polyimide resin adhesive in the form of film or paste. This product has been used typically as an adhesive for bonding polyimide-laminate-faced sandwich structures in radar-transparent assemblies, but usage is not limited to such applications. The adhesive is useful over the temperature range -55 degrees to +315 degrees C (-67 degrees to +600 degrees )F.
SAE AMS3686A-1991 history
2022SAE AMS3686A-2022 Adhesive, Polyimide Resin, Film and Paste High Temperature Resistant, 315 °C (599 °F)
1991SAE AMS3686A-1991 Adhesive, Polyimide Resin, Film and Paste High Temperature Resistant, 315 Degrees C (599 Degrees F)
1975SAE AMS3686-1975 ADHESIVE, POLYIMIDE RESIN, FILM AND PASTE High Temperature Resistant, 315°C or 600°F