IEC 61249-8-8:1997 PDF

Scope: This specification within the IEC 61249 series details requirements for the qualification of temporary solder resist coatings. These have been referred to as a mask in this specification since they have the facility of being readily removed. Peelable solder masks are applied (usually by screen printing) to areas of a completed printed board or panel prior to shipment, in order to protect areas of the board or panel during subsequent processes by the board assembler. Typically, peelable solder masks are used to protect keypad contacts during fluxing and subsequent mass soldering. Removal of the mask will then leave a residue-free untinned contact area. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks. Requirements for the release of printed boards using peelable solder masks should be included in the Customer Detail Specification (CDS). Requirements for the qualification of permanent polymeric solder resistive coatings are given in IEC 61249-8-5, which has been used as a template in constructing this specification, in as far as it may apply. note: 1) To be published.

IEC 61249-8-8:1997 history

1997 IEC 61249-8-8:1997 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings