This standard specifies copper-clad laminates for printed wiring boards (hereinafter referred to as copper-clad laminates) that use paper-based phenolic resin.
JIS C 6485:1997 history
2008JIS C 6485:2008 Base materials for printed circuits -- Paper base, phenolic resin
1997JIS C 6485:1997 Copper-clad laminates for printed wiring boards -- Paper base, phenolic resin