DIN 50441-1:1996 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation
The method covers determination of the thickness of circular or D-shaped semiconductor wafers with any surface quality by using both contactless and contacting instruments for thickness measurement.
DIN 50441-1:1996 history
1996DIN 50441-1:1996 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation