IEC 60068-2-20:1979
Environmental testing. Part 2: Tests. Test T: Soldering

Standard No.
IEC 60068-2-20:1979
Release Date
1979
Published By
International Electrotechnical Commission (IEC)
Status
 2008-07
Replace By
IEC 60068-2-20:1979/AMD1:1986
Latest
IEC 60068-2-20:2021 RLV
Scope
Is applicable to all electrical and electronic components liable to be submitted to the tests described herein. Determines the ability of component terminations and printed circuits to wet easily, and checks that the component itself will not be damaged

IEC 60068-2-20:1979 history

  • 0000 IEC 60068-2-20:2021 RLV
  • 2008 IEC 60068-2-20:2008 Environmental testing - Part 2: Tests - Test T: Test methods for soldeability and resistance to soldering heat of devices with leads
  • 1970 IEC 60068-2-20:1979/AMD2:1987 Amendment 2 - Basic environmental testing procedures - Part 2-20: Tests - Test T: Soldering
  • 1970 IEC 60068-2-20:1979/AMD1:1986 Amendment 1 - Basic environmental testing procedures - Part 2: Tests - Test T: Soldering
  • 1979 IEC 60068-2-20:1979 Environmental testing. Part 2: Tests. Test T: Soldering
  • 1970 IEC 60068-2-20:1968 Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test T: Soldering
  • 1970 IEC 60068-2-20:1960 Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test T: Soldering



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