IEC 61249-5-1:1995 PDF

Standard No.: IEC 61249-5-1:1995
Release Date: 1995
Published By: International Electrotechnical Commission (IEC)
Latest: IEC 61249-5-1:1995
Replace: IEC 52/544/DIS:1995 IEC 60249-3A:1976

Scope: Gives requirements for properties of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed boards.

IEC 61249-5-1:1995 history

1995 IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) has been changed from IEC 60249-3A:1976 Base materials for printed circuits. Part 3 : Special materials used in connection with printed circuits. First supplement: Specification No. 2: Specification for copper foil for use in the manufacture of copper-clad base materials.

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

IEC 61249-5-1:1995Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

IEC 61249-5-1:1995 history

IEC 61249-5-1:1995
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)