GB/T 15615-1995
Test method for measuring flexture strength of silicon slices (English Version)

Standard No.

GB/T 15615-1995

Language

Chinese, Available in English version

Release Date

1995

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Status

Withdraw

Latest

GB/T 15615-1995

Scope

This standard specifies the test method for the flexural strength of silicon single crystal cutting wafers, grinding wafers and polishing wafers (silicon wafers for short). This standard is applicable to the measurement of the bending strength at room temperature of Czochralski and suspension zone fused silicon single wafers with crystal orientations <111> and <100>. The thickness of the silicon wafer is 250-900 μm.

GB/T 15615-1995 history

• 1995 GB/T 15615-1995 Test method for measuring flexture strength of silicon slices